Metal Package for HIC
ya Chen
Contact person
Basic Information
| Place of Origin | Jiangsu China (Mainland) |
|---|---|
| Brand Name | jitai |
Metal Package for HIC Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly. Material:4J29(FeNiCo) alloy. Surface plating:selective Au plating. Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.
Delivery terms and packaging
Port: YiXing
Payment term
Telegraphic transfer
-
Payment Methods
We accept:
