| Place of Origin |
Jiangsu China (Mainland) |
Metal Package Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly. Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.