| Place of Origin |
Jiangsu China (Mainland) |
| Brand Name |
jitai |
Plug-in-sidewall Metal Package for HIC Specifications: 1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,suitable for plug-in assembly. 2.Material:4J29(FeNiCo) alloy.3.Surface plating:Ni/Au plating,selective Au plating.Technical requirements:1.All of the property index should conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>2.Remove all burrs and sharp edges.3.Finish:Au thickness ≥1µm,≤5.7µm,Ni thickness 1.3µm-14.43µm4.RoSHMDIP3529-P24PMDIP1616-P8PMDIP2009-P8PMDIP2119-P12PMDIP2212-P16PMDIP2213-P14PMDIP2314-P14PMDIP2513-P14PMDIP2713-P6PMDIP3116-P10PMDIP3222-P4PMDIP3320-P10PMDIP3320-P24PMDIP3524-P20PMDIP3529-P24P