High-power metal package High-power metal package Application areas:All kinds hybrid thick film and thin-film integrated circuits package. Material:Steel\Copper\WCu alloy etc
TO-46 Header TO-46 Header We provide glass-to-metial sealing with outstanding properties. Including:ability to withstand high pressure special glass with high el
Metal Package for Electronic Components Metal Package for Electronic Components Application areas:All kinds of photolauncher\photodetecter\photomodulator and photoamplifier. Products type:M
Butterfly Package Butterfly Package General information: 1.Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applie
Can-flat form Metal Package Can-flat form Metal Package Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwav
Metal Package Metal Package Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly. Material:4J29(F
Plug-in-sidewall Metal Package Plug-in-sidewall Metal Package for HIC Specifications: 1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,s
Metal Package metal package Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly. Material:4J29(F
Metal Package for HIC Metal Package for HIC Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly. Materia
High-power devices metal package High-power devices metal package Application areas:All kinds hybrid thick film and thin-film integrated circuits package. Material:Steel\Copper\WCu a
